Download Cradle scSTREAM + HeatDesigner 2020 Patch6 x64 full license

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Cradle scSTREAM + HeatDesigner 2020 full license

System: 64bit
Interface language: English
System requirements: Win 7 SP1 / 10 64-bit
Description: scSTREAM – application for mathematical modeling of problems of hydrodynamics and heat transfer with a structured grid
The calculation models in scSTREAM are based on a simple and easy to construct structured grid. A grid of this type consists of many small cuboids, so it approximates curved surfaces only in a stepped structure.
This grid option is used in cases where curved surfaces or small parts do not significantly affect the overall result. Examples of the use of structured grids are found in modeling the cooling of electronics, heating, ventilation and air conditioning, as well as in the design of architectural structures.
Features, functions and tasks specific to scSTREAM:
Different methods of representing geometry
The shape of the model to be analyzed can be represented using the following methods:
– voxel method (inclined and curved surfaces are presented in cuboids);
– the method of beveled cells (refinement of the model created using the CAD-system);
– finite element method (an arbitrary shape model with an unstructured grid can be superimposed on a model with a structured grid, which allows you to use a model from a CAD system in its original form).
Modeling the movement of objects
The scSTREAM system allows you to calculate the flow generated by an absolutely rigid moving object. As conditions, such parameters as object motion (displacement, rotation, elastic deformation), heat generation / absorption, air supply / exhaust can be set. Another model is created for the model of a moving object. With this approach, conditions such as the distance traveled by an object are practically unlimited, and this allows you to create models of arbitrary complexity.
Scaling boundary conditions
If the target phenomenon under study has an order of magnitude smaller than the size of the environment that affects it, then the results of environmental analysis can be used as boundary conditions in order to reduce the time and number of calculations.
Free surface
The software calculates the shape of the contact surface between gaseous and liquid substances. This function is useful in a wide range of areas: from tsunami analysis in the field of civil engineering and construction to soldering analysis in the field of electronics.
Calculation of high complexity models
With a structured grid, a complex model practically does not need to be adjusted, since the shape and size of the model elements do not affect the complexity of mesh generation. In addition, in parallel computing, the calculation is performed at high speed. This ensures the efficiency of data processing.
Local mesh refinement
Grinding the mesh can be done locally to more accurately represent the shape of the model and efficiently perform the calculation.
Creating custom variables and scripts
Defining complex conditions containing trigonometric functions or branches with an IF statement can be performed without compilation.
Electronic Component Library
The geometry and properties of frequently used parts can be saved to the library for future reuse, which saves time when creating a calculation model.
Thermal Path Display (HeatPathView)
The information obtained at the post-processing stage of the results of CFD analysis on the temperature of each part and the total amount of heat generated is not enough to understand the thermal path. HeatPathView displays the heat trajectory and the amount of heat transferred throughout the computing area using charts, graphs and tables, making it easy to find bottlenecks.
Import data from CAD electronic devices
This function allows you to read and import data on the circuit diagram of the printed circuit board from the CAD system. This allows you to get a more realistic simulation result taking into account the heat transfer caused by the uneven wiring diagram.
The HeatDesigner module (included in the scSTREAM distribution kit) is designed to perform thermal calculations of electronic components
HeatDesigner is a specialized solution based on scSTREAM, which is designed for the thermal calculation of electronics. HeatDesigner performance is optimized for cases where precise reproduction of curvilinear geometry is not required to predict flow field. However, HeatDesigner supports a grid consisting of more than one hundred million elements, which allows you to accurately describe small geometry elements. As with scSTREAM, the main advantages of HeatDesigner are its short calculation time and low consumption of computing resources.
Features, functions and tasks specific to HeatDesigner:
Calculation of high complexity models
With a structured grid, a complex model practically does not need to be adjusted, since the shape and size of the model elements do not affect the complexity of mesh generation. In addition, in parallel computing, the calculation is performed at high speed. This ensures the efficiency of data processing.
Local mesh refinement
Grinding the mesh can be done locally to more accurately represent the shape of the model and efficiently perform the calculation.
Creating custom variables and scripts
Defining complex conditions containing trigonometric functions or branches with an IF statement can be performed without compilation.
Electronic Component Library
The geometry and properties of frequently used parts can be saved to the library for future reuse, which saves time when creating a calculation model.
Thermal Path Display (HeatPathView)
The information obtained at the post-processing stage of the results of CFD analysis on the temperature of each part and the total amount of heat generated is not enough to understand the thermal path. HeatPathView displays the heat trajectory and the amount of heat transferred throughout the computing area using charts, graphs and tables, making it easy to find bottlenecks.
Import data from CAD electronic devices
This function allows you to read and import data on the circuit diagram of the printed circuit board from the CAD system. This allows you to get a more realistic simulation result taking into account the heat transfer caused by the uneven wiring diagram.
Examples of tasks to be solved:
Simulation of boiling, condensation
Light Analysis
Modeling of solar radiation
Air humidity analysis (condensation and evaporation processes)
Vegetation modeling (wind, cooling due to evaporation)
Wind load modeling
Evaluation of the effect of the electrostatic field
Foaming Resin Modeling
Solidification / Melting Modeling
Joule Heat Simulation
Particle tracking (behavior, reactions, interactions)
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